High Performance Embedded Box IPC (MIC-7000)

The compact modular PC support i-module expansion to satisfy diverse application requirements. Modular computer reduces lead time for CTOS due to easy configuration and can be widely deployed for factory and machine automation.

MIC-7500

Intel 6th Generation Core i Processor Compact Fanless System
MIC-770

Compact Fanless System with 8th Gen Intel® Core™ i CPU Socket (LGA 1151)
MIC-770 V2

Compact Fanless System with 10th Gen Intel® Xeon®/Core™ i CPU Socket (LGA 1200)
MIC-770 V3

Compact Fanless System with 12th Gen Intel® Core™ i CPU Socket (LGA 1700)
MIC-7700

Intel® 6th/7th Generation Core i Desktop Compact Fanless System
MIC-7900

Intel Xeon Processor Broadwell-DE SoC Compact Fanless System